What are the advantages and disadvantages of SMT processing?

Advantages:

1. High reliability and strong vibration resistance. Low defect rate of solder joint.

2. Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference.

3. High assembly density, small size and light weight of electronic products, the volume and weight of the patch components are only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.

4. Easy to achieve automation, improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc.

Cons:

1. No cleaning can reduce the damage caused by the PCBA during movement and cleaning. There are still some components that cannot be cleaned.

2. The waste water after product cleaning in the production process brings pollution of water quality, earth and animals and plants.

3. Reduce cleaning operation and machine maintenance costs.

4. The residual amount of flux has been controlled and can be used in accordance with the appearance requirements of the product to avoid the problem of visual inspection of the cleaning state.

5. The residue of cleaning agent will cause corrosion on the machine board, seriously affecting the quality of the product.

6. The wash-free process has passed a number of international safety tests, proving that the chemicals in the flux are stable and non-corrosive.

The pursuit of miniaturization of electronic products, the previously used perforated plug-in components can not be reduced, the function of electronic products is more complete, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, have to use surface chip components product mass, production automation, the factory to low cost and high output, Produce quality products to meet customer needs and enhance market competitiveness.